Soldering and Surface Mount Technology
Published by Emerald Publishing
ISSN : 0954-0911
Abbreviation : Solder. Surf. Mt. Technol.
Aims & Scope
Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area.
Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.
The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes.
The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices.
The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
View Aims & ScopeMetrics & Ranking
Impact Factor
| Year | Value |
|---|---|
| 2025 | 1.8 |
SJR (SCImago Journal Rank)
| Year | Value |
|---|---|
| 2024 | 0.314 |
Quartile
| Year | Value |
|---|---|
| 2024 | Q3 |
h-index
| Year | Value |
|---|---|
| 2024 | 38 |
Impact Factor Trend
Abstracting & Indexing
Journal is indexed in leading academic databases, ensuring global visibility and accessibility of our peer-reviewed research.
Subjects & Keywords
Journal’s research areas, covering key disciplines and specialized sub-topics in Engineering, Materials Science and Physics and Astronomy, designed to support cutting-edge academic discovery.
Most Cited Articles
The Most Cited Articles section features the journal's most impactful research, based on citation counts. These articles have been referenced frequently by other researchers, indicating their significant contribution to their respective fields.
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Detection of solder paste defects with an optimizationâ€based deep learning model using image processing techniques
Citation: 151
Authors: Ali, Aytaç
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Viscoplastic Anand model for solder alloys and its application
Citation: 111
Authors: Z.N., G.Z., L., J., K.
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Reactions between Sn–Ag–Cu leadâ€free solders and the Au/Ni surface finish in advanced electronic packages
Citation: 106
Authors: L.C., C.E., C.R.
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The role of intermetallic compounds in leadâ€free soldering
Citation: 86
Authors: Paul G., Kaldev S.
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Effect of Ag content on the microstructure of Snâ€Agâ€Cu based solder alloys
Citation: 71
Authors: M., J., M., C.
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Microstructural characterisation of reflowed and isothermallyâ€aged Cu and Ag particulate reinforced Snâ€3.5Ag composite solders
Citation: 70
Authors: F., S., J.P., K.N.