Smart Materials in Medicine
Published by KeAi Communications Co. (Journal Finder)
eISSN : 2590-1834
Abbreviation : Smart Mater. Med.
Aims & Scope
Smart Materials in Medicine is a peer-reviewed scientific journal covering all aspects of smart materials with applications in the fields of biotechnology, medicine and healthcare.
The journal welcomes the submission of research papers, reviews and rapid communications.
Smart materials, also referred to intelligent or responsive materials, are designed materials with one or more properties that can be significantly changed in a controlled fashion by external stimuli, such as stress, temperature, moisture, pH, electric or magnetic fields, light, or chemical compounds.
Smart Materials in Medicine will cover all aspects of smart materials intended for biomedical applications.
Submissions should include researches that provide novel scientific and/or engineering findings underlying the design, fabrication, processing, microstructure, properties and/or applications of smart materials.
We also welcome reports that contribute to the body of knowledge by documenting the thinking, philosophy, and/or strategies of smart material sciences and engineering.
Typical smart materials include, but are not limited to: - Chemoresponsive materials - Chromogenic materials - Dielectric elastomers - Electroactive polymers - Ferrofluid - Halochromic materials - Magnetocaloric materials - Materials with controlled release - Materials with controlled degradation - Photomechanical materials - Photovoltaic materials - pH-sensitive materials - Piezoelectric materials - Polycaprolactone - Self-healing materials - Shape-memory materials - Temperature-responsive materials - Thermoelectric materials - Catalytic Materials
View Aims & ScopeMetrics & Ranking
SJR (SCImago Journal Rank)
| Year | Value |
|---|---|
| 2024 | 1.644 |
Quartile
| Year | Value |
|---|---|
| 2024 | Q1 |
h-index
| Year | Value |
|---|---|
| 2024 | 31 |
Journal Rank
| Year | Value |
|---|---|
| 2024 | 2052 |
Journal Citation Indicator
| Year | Value |
|---|---|
| 2024 | 1047 |
Abstracting & Indexing
Journal is indexed in leading academic databases, ensuring global visibility and accessibility of our peer-reviewed research.
Subjects & Keywords
Journal’s research areas, covering key disciplines and specialized sub-topics in Chemical Engineering, Engineering and Materials Science, designed to support cutting-edge academic discovery.
Licensing & Copyright
This journal operates under an Open Access model. Articles are freely accessible to the public immediately upon publication. The content is licensed under a Creative Commons Attribution 4.0 International License (CC BY 4.0), allowing users to share and adapt the work with proper attribution.
Copyright remains with the author(s), and no permission is required for non-commercial use, provided the original source is cited.
Policy Links
This section provides access to essential policy documents, guidelines, and resources related to the journal’s publication and submission processes.
- Aims scope
- Homepage
- Oa statement
- Author instructions
- License terms
- Review url
- Board url
- Copyright url
- Plagiarism url
- Preservation url
- Apc url
- License
Plagiarism Policy
This journal follows a plagiarism policy. All submitted manuscripts are screened using reliable plagiarism detection software to ensure originality and academic integrity. Authors are responsible for proper citation and acknowledgment of all sources, and any form of plagiarism, including self-plagiarism, will not be tolerated.
For more details, please refer to our official: Plagiarism Policy.
APC Details
The journal’s Article Processing Charge (APC) policies support open access publishing in Chemical Engineering, Engineering and Materials Science, ensuring accessibility and quality in research dissemination.
This journal requires an Article Processing Charge (APC) to support open access publishing, covering peer review, editing, and distribution. The current APC is 840.00 USD. Learn more.
Explore journals without APCs for alternative publishing options.