Microelectronics International

Aims & Scope

Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering.

It represents a current, comprehensive and practical information tool.

The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication.

Please view the Author Guidelines for further details.

Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages.

Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.

View Aims & Scope

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Metrics & Ranking

SJR (SCImago Journal Rank)

Year	Value
2024	0.186

Quartile

Year	Value
2024	Q4

h-index

Year	Value
2024	25

Journal Rank

Year	Value
2024	22108

Journal Citation Indicator

Year	Value
2024	66

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Abstracting & Indexing

Journal is indexed in leading academic databases, ensuring global visibility and accessibility of our peer-reviewed research.

• Scopus
• Google Scholar

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Subjects & Keywords

Journal’s research areas, covering key disciplines and specialized sub-topics in Engineering, Materials Science and Physics and Astronomy, designed to support cutting-edge academic discovery.

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Most Cited Articles

The Most Cited Articles section features the journal's most impactful research, based on citation counts. These articles have been referenced frequently by other researchers, indicating their significant contribution to their respective fields.

• Overview and outlook of through‐silicon via (TSV) and 3D integrations

  Citation: 288

  Authors: John H.

• Using LTCC for microsystems

  Citation: 70

  Authors: Torsten, Heiko, Michael

• 3D LED and IC wafer level packaging

  Citation: 60

  Authors: John, Ricky, Matthew, Philip

• A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low‐Ag Sn‐Ag‐Cu solder joints

  Citation: 50

  Authors: Dhafer, Mohd, Irfan, Suhana

• Analytical modeling for the estimation of leakage current and subthreshold swing factor of nanoscale double gate FinFET device

  Citation: 47

  Authors: Balwinder, A.K., S.

• Thick film NTC thermistor for wide range of temperature sensing

  Citation: 47

  Authors: Shweta, Sunit, Uttamrao, Dinesh

• Wire bonding using copper wire

  Citation: 47

  Authors: Z.W.

• Thermal deformation analysis of BGA package by digital image correlation technique

  Citation: 43

  Authors: J., M., C.Y., J., S.

• Effect of dissolution and intermetallic formation on the reliability of FC joints

  Citation: 40

  Authors: Kari, Vesa, Jorma

• Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey‐based Taguchi method

  Citation: 40

  Authors: Chun‐Sean, M.Z., C.Y.

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