Journal of Microelectronics and Electronic Packaging

Aims & Scope

Journal of Microelectronics and Electronic Packaging is a publication of the International Microelectronics Assembly and Packaging Society (IMAPS) and is dedicated to publishing peer-reviewed papers in research, development, and the application relating to all aspects of microelectronics packaging, interconnect and assembly technologies.

This journal covers materials, processes, reliability, design, systems, and applications in microelectronics assembly and packaging technologies of the present and future including 3D integration, Ceramic Interconnect, Soldering, Flip Chip, Wire Bonding, Encapsulation, RF and microwaves, MEMS, Photonics, Power/High Temperature Electronics, Printed Electronics, LED packaging, and Medical Electronics.

The journal will publish papers describing both new and A paper presented at a conference or published in a conference proceedings will be considered for this journal.

Short technical notes that clearly pertain to the journal’s mission will also be considered for publication.

Metrics & Ranking

Abstracting & Indexing

Journal is indexed in leading academic databases, ensuring global visibility and accessibility of our peer-reviewed research.

• Scopus
• Google Scholar
• Directory of Open Access Journals (DOAJ)

Subjects & Keywords

Journal’s research areas, covering key disciplines and specialized sub-topics in Computer Science, Engineering and Materials Science, designed to support cutting-edge academic discovery.

Licensing & Copyright

This journal operates under an Open Access model. Articles are freely accessible to the public immediately upon publication. The content is licensed under a Creative Commons Attribution 4.0 International License (CC BY 4.0), allowing users to share and adapt the work with proper attribution.

Copyright remains with the author(s), and no permission is required for non-commercial use, provided the original source is cited.

Policy Links

This section provides access to essential policy documents, guidelines, and resources related to the journal’s publication and submission processes.

• Aims scope
• Homepage
• Oa statement
• Author instructions
• License terms
• Review url
• Board url
• Copyright url
• Apc url
• License

Most Cited Articles

The Most Cited Articles section features the journal's most impactful research, based on citation counts. These articles have been referenced frequently by other researchers, indicating their significant contribution to their respective fields.

• Broadband Dielectric Characterization of Aluminum Oxide (Al2O3)

  Citation: 64

  Authors: Khalid Z., Mira, Edmund H., Juan C., Daniel, David, Raj, Michael

• Redistribution Layers (RDLs) for 2.5D/3D IC Integration

  Citation: 48

  Authors: J., P., C., C., M., J., K., Y., P., Y., J., S., C., H., C., C., T., R., M.

• Recent Advances and Trends in Heterogeneous Integrations

  Citation: 40

  Authors: John H.

• Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)

  Citation: 31

  Authors: John, Ming, Nelson, Eric, Zhang, Kim Hwee, Tony, Iris, Margie, Y. M., Wu, Ji, Rozalia, Tom, CT, Henry, Y. H., Sze Pei, N. C., Jiang, Koh Sau, Qingxiang, Cao, Mian, Jeffery, Ricky

• Localized Laser Sintering of Metal Nanoparticle Inks Printed with Aerosol Jet® Technology for Flexible Electronics

  Citation: 31

  Authors: Michael J., Matthew, Jaxon, James Q.

• Year-long 500°C Operational Demonstration of Up-scaled 4H-SiC JFET Integrated Circuits

  Citation: 29

  Authors: Philip G., David J., Michael J., Norman F., Glenn M., Liang-Yu, Carl W.

• Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration

  Citation: 26

  Authors: Cheng-Ta, Henry, John, Ming, Margie, Curry, J. W., Chieh-Lin, Jhih-Yuan, Hsing-Hui, Yu-Hua, Tony, Iris, Penny, Nelson, Eric, Zhang, Kim Hwee, Chia-Hung, Rozalia, Marc, Cao, Sze Pei, Ning Cheng, Mian, Jeffery, Ricky

• Using Permanent and Temporary Polyimide Adhesives in 3D-TSV Processing to Avoid Thin Wafer Handling

  Citation: 24

  Authors: M. P., C., A., S., T.

• Thermal Performance of 3D IC Integration with Through-Silicon Via (TSV)

  Citation: 24

  Authors: Heng-Chieh, John H., Yu-Lin, Ra-Min, Ming-Ji, Sheng-Tsai, Wei-Chung, Ming-Jer

• Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications

  Citation: 22

  Authors: Siddharth, Shuhei, Tomonori, Tailong, Fuhan, Vanessa, Venky, Rao