Journal of Japan Institute of Electronics Packaging

Metrics & Ranking

SJR (SCImago Journal Rank)

Year	Value
2024	0.160

Quartile

Year	Value
2024	Q4

h-index

Year	Value
2024	11

Journal Rank

Year	Value
2024	23778

Journal Citation Indicator

Year	Value
2024	17

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Abstracting & Indexing

Journal is indexed in leading academic databases, ensuring global visibility and accessibility of our peer-reviewed research.

• Scopus
• Google Scholar

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Subjects & Keywords

Journal’s research areas, covering key disciplines and specialized sub-topics in Engineering, designed to support cutting-edge academic discovery.

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Most Cited Articles

The Most Cited Articles section features the journal's most impactful research, based on citation counts. These articles have been referenced frequently by other researchers, indicating their significant contribution to their respective fields.

• Convenient Debonding Strength Evaluation Based on the Intensity of Singular Stress for Adhesive Joints

  Citation: 26

  Authors: Nao-Aki, Tatsujiro, Takumi, Rong, Yoshikazu, Yasushi

• Proposal and Investigation of Unbalanced Dipole Antenna with Semicircular and Trapezoidal Radiators for UWB Radio

  Citation: 24

  Authors: Fukuro, Toshiya, Koichi, Kohji

• FEM Analysis of Thermal Cycle Properties of the Substrates for Power Modules.

  Citation: 24

  Authors: Yoshiyuki, Toshiyuki, Shoichi

• Citation: 21

  Authors: Yorishige

• New Chromium Free Pretreatment Method for Plating on ABS Resin Using TiO2 under UV Light Irradiation

  Citation: 19

  Authors: Katsuhiko, Masaharu, Kenji, Takeshi, Hideo

• Thermo-Viscoelastic Analysis for Warpage of Ball Grid Array Packages Taking into Consideration of Chemical Shrinkage of Molding Compound

  Citation: 17

  Authors: Kiyoshi

• Debonding Criterion for Single Lap Joints from the Intensity of Singular Stress Field

  Citation: 16

  Authors: Tatsujiro, Nao-Aki, Rong, Takumi, Yoshikazu

• Influence of Bath Composition to Via-Filling by Copper Electroplating.

  Citation: 16

  Authors: Takeshi, Junichi, Kuniaki, Tsugito, Hideo

• Formation of Integrated Circuit Interconnection Using Copper Electroplating.

  Citation: 15

  Authors: Yuichi, Kimiko, Shuhei, Hideo

• Thermal Fatigue Life Simulation for Sn-Ag-Cu Lead-Free Solder Joints

  Citation: 15

  Authors: Hiroyuki, Takashi, Minoru, Nobutada

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