Journal of Electronic Packaging

Aims & Scope

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.

View Aims & Scope

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Metrics & Ranking

Impact Factor

Year	Value
2025	2.3
2024	2.20

Journal Rank

Year	Value
2024	11082

Journal Citation Indicator

Year	Value
2024	511

SJR (SCImago Journal Rank)

Year	Value
2024	0.524

Quartile

Year	Value
2024	Q2

h-index

Year	Value
2024	65

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Abstracting & Indexing

Journal is indexed in leading academic databases, ensuring global visibility and accessibility of our peer-reviewed research.

• Scopus
• Google Scholar
• Web of Science

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Subjects & Keywords

Journal’s research areas, covering key disciplines and specialized sub-topics in Computer Science, Engineering and Materials Science, designed to support cutting-edge academic discovery.

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Most Cited Articles

The Most Cited Articles section features the journal's most impactful research, based on citation counts. These articles have been referenced frequently by other researchers, indicating their significant contribution to their respective fields.

• Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

  Citation: 418

  Authors: Dongliang, Xin, Xiaokun, Saad Ayub, Ronggui

• Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations

  Citation: 301

  Authors: Issam

• Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys

  Citation: 261

  Authors: G. Z., Z. N., K., J.

• Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction

  Citation: 243

  Authors: Robert

• Review of Heat Transfer Technologies in Electronic Equipment

  Citation: 239

  Authors: L. T.

• Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection

  Citation: 225

  Authors: A., R. L.

• A Thermodynamic Framework for Damage Mechanics of Solder Joints

  Citation: 207

  Authors: C., C.-Y.

• Thermal Spreading Resistance of Eccentric Heat Sources on Rectangular Flux Channels

  Citation: 191

  Authors: Y. S., J. R., M. M.

• Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach

  Citation: 178

  Authors: A., C., D., M.

• Optimal Thermal Design of Forced Convection Heat Sinks-Analytical

  Citation: 177

  Authors: R. W., J. S., D. J.

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