Journal of Electronic Materials
Published by Springer Nature
ISSN : 0361-5235 eISSN : 1543-186X
Abbreviation : J. Electron. Mater.
Aims & Scope
The journal welcomes articles on methods for preparing and evaluating the chemical, physical, electronic, and optical properties of these materials.
Specific areas of interest are materials for state-of-the-art transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications.
All submissions to the Journal of Electronic Materials must be within its scope, and advance scientific knowledge by addressing important questions relevant for the research of electronic materials.
View Aims & ScopeMetrics & Ranking
Impact Factor
Year | Value |
---|---|
2025 | 2.5 |
2024 | 2.20 |
Journal Rank
Year | Value |
---|---|
2024 | 12092 |
Journal Citation Indicator
Year | Value |
---|---|
2024 | 5954 |
SJR (SCImago Journal Rank)
Year | Value |
---|---|
2024 | 0.475 |
Quartile
Year | Value |
---|---|
2024 | Q2 |
h-index
Year | Value |
---|---|
2024 | 117 |
Impact Factor Trend
Abstracting & Indexing
Journal is indexed in leading academic databases, ensuring global visibility and accessibility of our peer-reviewed research.
Subjects & Keywords
Journal’s research areas, covering key disciplines and specialized sub-topics in Engineering, Materials Science and Physics and Astronomy, designed to support cutting-edge academic discovery.
Most Cited Articles
The Most Cited Articles section features the journal's most impactful research, based on citation counts. These articles have been referenced frequently by other researchers, indicating their significant contribution to their respective fields.
-
Estimation of the thermal band gap of a semiconductor from seebeck measurements
Citation: 755
Authors: H. J., J. W.
-
Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
Citation: 505
Authors: K. -W., W. J., U. R., F. S., C. A.
-
Thermo-mechanical Characterization of Metal/Polymer Composite Filaments and Printing Parameter Study for Fused Deposition Modeling in the 3D Printing Process
Citation: 407
Authors: Seyeon, Edgar I., Kyoung-sik, Raymond C., Nam Soo
-
High Thermoelectric Performance of Dually Doped ZnO Ceramics
Citation: 387
Authors: Michitaka, Kazuhiko, Kiyoshi
-
GaN Technology for Power Electronic Applications: A Review
Citation: 378
Authors: Tyler J., Bejoy N., Stephen B.
-
Thermal behavior of silver nanoparticles for low-temperature interconnect applications
Citation: 348
Authors: Kyoung-Sik, Hai, Radenka, Suresh, Andrew, Yi, C. P.
-
Ultraviolet detectors based on epitaxial ZnO films grown by MOCVD
Citation: 338
Authors: Y., C. R., S., N., Y., H., M.
-
Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
Citation: 312
Authors: Tao, Xu, Guo-Quan, Guang-Yin