IEEE Transactions on Electronics Packaging Manufacturing

Aims & Scope

This journal addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

Abstracting & Indexing

Journal is indexed in leading academic databases, ensuring global visibility and accessibility of our peer-reviewed research.

• Scopus
• Google Scholar

Subjects & Keywords

Journal’s research areas, covering key disciplines and specialized sub-topics in Engineering, designed to support cutting-edge academic discovery.

Most Cited Articles

The Most Cited Articles section features the journal's most impactful research, based on citation counts. These articles have been referenced frequently by other researchers, indicating their significant contribution to their respective fields.

• The Changing Automotive Environment: High-Temperature Electronics

  Citation: 739

  Authors: R.W., J.L., P., J.R.R., M.

• Electron beam lithography in nanoscale fabrication: recent development

  Citation: 413

  Authors: A.A., C.D., K.J.

• Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow

  Citation: 186

  Authors: Z.

• Annotated tin whisker bibliography and anthology

  Citation: 167

  Authors: G.T.

• Fine-line conductor manufacturing using drop-on demand PZT printing technology

  Citation: 162

  Authors: J.B., C.M., D.R.

• Printed circuit board recycling: a state-of-the-art survey

  Citation: 154

  Authors: P.

• Rough set theory: a data mining tool for semiconductor manufacturing

  Citation: 150

  Authors: A.

• Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives

  Citation: 149

  Authors: A.

• Scalability of Roll-to-Roll Gravure-Printed Electrodes on Plastic Foils

  Citation: 144

  Authors: Jinsoo, Dongsun, Chaemin, Hwajin, Jukyung, Junseok, Yongsu, Vivek, Gyoujin

• Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices

  Citation: 131

  Authors: John G., Jesus N., Guo-Quan