IEEE Transactions on Components, Packaging and Manufacturing Technology

Aims & Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

View Aims & Scope

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Metrics & Ranking

Impact Factor

Year	Value
2025	3

Journal Rank

Year	Value
2024	7879

Journal Citation Indicator

Year	Value
2024	2441

SJR (SCImago Journal Rank)

Year	Value
2024	0.716

Quartile

Year	Value
2024	Q1

h-index

Year	Value
2024	119

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Abstracting & Indexing

Journal is indexed in leading academic databases, ensuring global visibility and accessibility of our peer-reviewed research.

• Scopus
• Google Scholar
• Web of Science

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Subjects & Keywords

Journal’s research areas, covering key disciplines and specialized sub-topics in Engineering and Materials Science, designed to support cutting-edge academic discovery.

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Most Cited Articles

The Most Cited Articles section features the journal's most impactful research, based on citation counts. These articles have been referenced frequently by other researchers, indicating their significant contribution to their respective fields.

• Recent Advances and Trends in Advanced Packaging

  Citation: 408

  Authors: John H.

• High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

  Citation: 399

  Authors: Joohee, Jun So, Jonghyun, Eakhwan, Jeonghyeon, Heegon, Taigon, Junho, Hyungdong, Kunwoo, Seungtaek, Min-Suk, Kwang-Yoo, Joungho

• Die Attach Materials for High Temperature Applications: A Review

  Citation: 395

  Authors: V R

• 3-D Printed Metal-Pipe Rectangular Waveguides

  Citation: 272

  Authors: Mario, William J., Jonathan, Brendan T. W., Callum, Nick M., Stepan

• Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs

  Citation: 227

  Authors: Vijay, Tapobrata, Venky, Rao

• Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

  Citation: 188

  Authors: Suresh V., Tim, Justin A., Vadim

• A Review of 5G Front-End Systems Package Integration

  Citation: 186

  Authors: Atom O., Muhammad, Sk Yeahia Been, Rao R., Markondeya Raj

• Wearable AMC Backed Near-Endfire Antenna for On-Body Communications on Latex Substrate

  Citation: 144

  Authors: Kush, Yong-Xin, Budiman

• Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

  Citation: 142

  Authors: Jonghyun, Eakhwan, Kihyun, Jun So, Joohee, Woojin, Taigon, Kiyeong, Junho, Hyungdong, Kunwoo, Seungtaek, Minsuk, Kwangyoo, Joungho

• Broadband Microwave Frequency Characterization of 3-D Printed Materials

  Citation: 139

  Authors: Paul I., Raymond C., Kenneth H.

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