IEEE Transactions on Advanced Packaging

Aims & Scope

IEEE Transactions on Advanced Packaging has its focus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability.

Abstracting & Indexing

Journal is indexed in leading academic databases, ensuring global visibility and accessibility of our peer-reviewed research.

• Scopus
• Google Scholar

Subjects & Keywords

Journal’s research areas, covering key disciplines and specialized sub-topics in Engineering, designed to support cutting-edge academic discovery.

Most Cited Articles

The Most Cited Articles section features the journal's most impactful research, based on citation counts. These articles have been referenced frequently by other researchers, indicating their significant contribution to their respective fields.

• Power distribution system design methodology and capacitor selection for modern CMOS technology

  Citation: 409

  Authors: L.D., R.E., D.W., T.J., T.

• Design and Characterization of Purely Textile Patch Antennas

  Citation: 369

  Authors: Ivo, Maciej, Tnde, Gerhard

• Power distribution networks for system-on-package: status and challenges

  Citation: 228

  Authors: M., Joungho, I., J.P.

• Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps

  Citation: 226

  Authors: C.S., J.H., S., K., T.C.

• Stability, Causality, and Passivity in Electrical Interconnect Models

  Citation: 219

  Authors: P., S., M.S., F.G., R.

• SOP: What Is It and Why? A New Microsystem-Integration Technology Paradigm-Moore's Law for System Integration of Miniaturized Convergent Systems of the Next Decade

  Citation: 208

  Authors: R.R.

• Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability

  Citation: 206

  Authors: Z., C.P.

• Electrical characterization of textile transmission lines

  Citation: 189

  Authors: D., J., T., G.

• Using self-assembly for the fabrication of nano-scale electronic and photonic devices

  Citation: 177

  Authors: B.A., D., G.M.

• Electromagnetic Interference (EMI) of System-on-Package (SOP)

  Citation: 174

  Authors: T., H., N., J.L.