Circuit World

Aims & Scope

Circuit World is a platform for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety.

The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics.

Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes.

Circuit World covers a broad range of topics, including: • Circuit theory, design methodology, analysis and simulation • Digital, analog, microwave and optoelectronic integrated circuits • Semiconductors, passives, connectors and sensors • Electronic packaging of components, assemblies and products • PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes) • Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal) • Internet of Things (IoT).

Metrics & Ranking

Abstracting & Indexing

Journal is indexed in leading academic databases, ensuring global visibility and accessibility of our peer-reviewed research.

• Scopus
• Google Scholar

Subjects & Keywords

Journal’s research areas, covering key disciplines and specialized sub-topics in Engineering, designed to support cutting-edge academic discovery.

Most Cited Articles

The Most Cited Articles section features the journal's most impactful research, based on citation counts. These articles have been referenced frequently by other researchers, indicating their significant contribution to their respective fields.

• Inkjet printing of conductive materials: a review

  Citation: 425

  Authors: Gerard, Marc P.Y.

• Recycling technologies for the treatment of end of life printed circuit boards (PCBs)

  Citation: 138

  Authors: Martin, Rod

• An integrated approach to electronic waste (WEEE) recycling

  Citation: 102

  Authors: I., N., R., N., K., M., L.

• Copper electroplating technology for microvia filling

  Citation: 59

  Authors: Mark, George, Masaru, Hideki, Masaru, Shinjiro

• Surface analysis of polymeric substrates used for inkjet printing technology

  Citation: 56

  Authors: Alena, Peter, Dagmar, Beata, Jerzy, Grzegorz, Jan, Katerina, Martin

• An overview of surface finishes and their role in printed circuit board solderability and solder joint performance

  Citation: 54

  Authors: Paul T.

• Design and performance of metal conductors for stretchable electronic circuits

  Citation: 52

  Authors: Mario, Fabrice, Frederick, Yung‐Yu, Bart, Jan

• Recycling of Printed Wiring Boards with Mounted Electronic Components

  Citation: 50

  Authors: M., S.

• Alternative Solders for Electronics Assemblies

  Citation: 47

  Authors: J.H., B.P., D.R., I.A., M., H.A.H., P.G., M.A., S.R., A.C., E.

• Calculation of flexible printed circuit boards (FPC) global and local defect detection based on computer vision

  Citation: 47

  Authors: Liya, Yang, Yaoming, Jingbin